Light emitting device package, and display apparatus and lighting system having the same

ABSTRACT

Disclosed are a light emitting device package, and a display apparatus and a lighting system having the same. The light emitting device package includes a body having a recess, a light emitting device received in the recess, and a lead frame connected to the light emitting device. The lead frame includes a bottom frame formed on a bottom surface of the recess, a first side-wall frame formed on a side wall of the recess, and a second side-wall frame formed on a side wall of the recess and bent at a predetermined angle. The second side-wall frame includes a side-wall portion positioned on the side wall of the recess and a protrusion portion bent from the side-wall portion, and the protrusion portion of the second side-wall frame is positioned on a top surface of the body.

The present application claims the benefit under 35 U.S.C. §119 ofKorean Patent Application No. 10-2010-0020834, filed Mar. 9, 2010, whichis hereby incorporated by reference in its entirety.

BACKGROUND

The embodiment relates to a lighting emitting device package and adisplay apparatus and a lighting system having the same.

A light emitting diode (LED) may constitute a light emitting source byusing GaAs, AlGaAs, GaN, InGaN, and InGaAlP-based compound semiconductormaterials, thereby representing various colors.

The characteristic of such an LED may be determined according to thematerial of a compound semiconductor, the color and the brightness ofthe emitted light, and the intensity range of the brightness. Inaddition, the LED is packaged and applied to various fields such as alighting indicator producing various colors, a character indicator, andan image indicator and the like.

SUMMARY

The embodiment provides a light emitting device package capable ofimproving a heat dissipation characteristic by lead frames, and adisplay apparatus and a lighting system having the same.

The embodiment provides a light emitting device package capable ofeffectively dissipating heat emitted from the light emitting device bylead frames formed on side walls of a recess as well as a bottom surfaceof the recess, and a display apparatus and a lighting system having thesame.

According to the embodiment, a light emitting device package comprises abody having a recess, a light emitting device received in the recess,and a lead frame connected to the light emitting device. The lead framecomprises a bottom frame formed on a bottom surface of the recess, afirst side-wall frame formed on a side wall of the recess, and a secondside-wall frame formed on a side wall of the recess and bent at apredetermined angle. The second side-wall frame comprises a side-wallportion positioned on the side wall of the recess and a protrusionportion bent from the side-wall portion, and the protrusion portion ofthe second side-wall frame is positioned on a top surface of the body.

According to the embodiment, a display apparatus comprises a lightemitting apparatus comprising at least one light emitting devicepackage, a light guide plate provided on the light emitting apparatus,and a display panel provided on the light guide plate. The lightemitting device package comprises a body having a recess, a lightemitting device provided in the recess, and a lead frame connected tothe light emitting device. The lead frame comprises a bottom frameformed on a bottom surface of the recess, a first side-wall frame formedon a side wall of the recess, and a second side-wall frame formed on aside wall of the recess and bent at a predetermined angle. The secondside-wall frame comprises a side-wall portion positioned on the sidewall of the recess and a protrusion portion bent from the side-wallportion, and the protrusion portion of the second side-wall frame ispositioned on a top surface of the body.

According to the embodiment, a lighting system comprises a case, a lightemitting module provided in the case and including at least one lightemitting device package, and a connection terminal provided in the caseto receive power from an external power source. The light emittingdevice package comprises a body having a recess therein, a lightemitting device received in the recess, and a lead frame connected tothe light emitting device. The lead frame comprises a bottom frameformed on a bottom surface of the recess, a first side-wall frame formedon a side wall of the recess, and a second side-wall frame formed on aside wall of the recess and bent at a predetermined angle. The secondside-wall frame comprises a side-wall portion positioned on the sidewall of the recess and a protrusion portion bent from the side-wallportion, and the protrusion portion of the second side-wall frame ispositioned on a top surface of the body.

The embodiment can provide a light emitting device package realizingsuperior heat dissipation characteristic, and a display apparatus and alighting system having the same.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a front view showing a light emitting device package accordingto the embodiment;

FIG. 2 is a perspective view showing a lead frame of FIG. 1;

FIG. 3 is a sectional view taken along an axis X of FIG. 1;

FIG. 4 is a sectional view showing a light emitting device packageaccording to another embodiment;

FIG. 5 is a view showing a display apparatus according to theembodiment;

FIG. 6 is a view showing another example of the display apparatusaccording to the embodiment; and

FIG. 7 is a view showing a lighting system according to the embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the description of the embodiments, it will be understood that, whena layer (or film), a region, a pattern, or a structure is referred to asbeing “on” or “under” another substrate, another layer (or film),another region, another pad, or another pattern, it can be “directly” or“indirectly” on the other substrate, layer (or film), region, pad, orpattern, or one or more intervening layers may also be present. Such aposition of the layer has been described with reference to the drawings.

The thickness and size of each layer shown in the drawings may beexaggerated, omitted or schematically drawn for the purpose ofconvenience or clarity. In addition, the size of elements does notutterly reflect an actual size.

Hereinafter, the embodiment will be described with reference toaccompanying drawings.

FIG. 1 is a plan view showing a light emitting device package accordingto the embodiment, and FIG. 2 is a perspective view showing a lead frameof FIG. 1. FIG. 3 is a sectional view taken along an axis X of FIG. 1.

Referring to FIGS. 1 to 3, a light emitting device package 100 accordingto the embodiment may comprise a side-emission-type light emittingdevice package or a top emission-type light emitting device package, andmay have the shape of a polygon such as a rectangular or a cubehexahedron. The light emitting device package 100 may be applied tolighting system fields such as a backlight unit or a light source of aliquid crystal display as a light unit. Hereinafter, the sideemission-type light emitting device package will be representativelydescribed for the purpose of explanation.

The light emitting device package 100 comprises a body 110 having arecess 120, lead frames 130 and 140, and a light emitting device 150.

For instance, the body 110 may comprise one selected from the groupconsisting of polyphthal amide (PPA), polyamide 9T (PA9T), liquidcrystal polymer (LCP), and syndiotactic polystyrene (SPS).

The recess 120 is formed at a predetermined depth on the top surface ofthe body 110.

In this case, when a first direction of the body 110 is referred to asan X axis direction, and a second direction of the body 110 is referredto as a Y axis direction, the length of the body 110 in the X axisdirection may be greater than the width of the body 110 in the Y axisdirection. However, the embodiment is not limited thereto.

The lead frames 130 and 140 are injection-molded at an upper portion ofthe body 110, and a portion of the lead frames 130 and 140 may beexposed from the recess 120.

In particular, the lead frames 130 and 140 are formed on lateral sidesof a space formed by the recess 120 as well as the bottom surface of therecess 120.

Referring to FIG. 2, the structure of the lead frames 130 and 140according to the present embodiment will be described in detail.

The lead frames 130 and 140 comprise bottom frames 131 and 141 of therecess 120, first side-wall frames 132 and 142, and second side-wallframes 133 and 143 provided at the side walls of the recess 120. Eachend portion of the second side-wall frames 133 and 143 may penetratethrough the body 110 in the X axis direction and serve as externalelectrodes.

The first and second side-wall frames 132,133,142 and 143 may beinclined at a predetermined angle outward from a Z axis perpendicular tothe bottom frames 131 and 141.

The lead frames 130 and 140 may comprise one selected from the groupconsisting of iron (Fe), tin (Sn), chromium (Cr), zinc (Zn), nickel(Ni), aluminum (Al), silver (Ag), gold (Au), copper (Cu), and the alloythereof. In particular, the lead frames 130 and 140 may comprise metalcapable of effectively dissipating heat emitted from the light emittingdevice 150 as the light emitting device 150 is driven.

The first side-wall frames 132 and 142 may be inclined at apredetermined angle with respect to the bottom frames 131 and 141. Thesecond side-wall frames 133 and 143 may be inclined at a predeterminedangle with respect to the bottom frames 131 and 141. The inclination ofthe first and second side-wall frames 132, 133, 142, and 143 isdetermined according to the shape of the internal wall of the recess 120formed in the body 110.

The second side-wall frames 133 and 143 comprises side-wall portions 133a and 143 a formed on one lateral sides of the recess 120 and protrusionportions 133 b and 143 b which are bent from the side-wall portions 133a and 143 a and serve as external electrodes.

The side-wall portions 133 a and 143 a of the second side-wall frames133 and 143 may be integrated with the first side-wall frames 132 and142 and surround all side walls of the recess 120.

The protrusion portions 133 b and 143 b of the second side-wall frames133 and 143 may protrude at a height substantially same to the heightsof the first side-wall frames 132 and 142 or at a height lower than theheights of the first side-wall frames 132 and 142. The protrusionportions 133 b and 143 b of the second side-wall frames 133 and 143 maypenetrate through the body 110 or may be formed on the body 110according to the height of the point from which the protrusion portions133 b and 143 b are bent.

According to the embodiment of the present invention, as shown in FIGS.1 to 3, the protrusion portions 133 b and 143 b of the second side-wallframes 133 and 143 penetrate through the upper portion of the body 110.According to another embodiment of the present invention, as shown inFIG. 4, the protrusion portions 133 b and 143 b of the second side-wallframes 133 and 143 are positioned on the top surface of the body 110.

In order to allow the protrusion portions 133 b and 143 b of the secondside-wall frame of the lead frames 130 and 140 to penetrate through aportion of the body 110 according to the embodiment of the presentinvention, after manufacturing a lead frame having a shape shown in FIG.2, the body 110 having a groove is molded such that the protrusionportions 133 b and 143 b can penetrate through the groove. In this case,as shown in FIG. 3, portions (i.e., protrusion portions 133 b and 143 b)of the second side-wall frames 133 and 143 penetrate through the body110 to be exposed out of the body 110.

The bottom frames 131 and 141 are positioned on the bottom surface ofthe recess 120 formed in the body 110, and the first side-wall frames132 and 142 are positioned on the two surfaces of the internal sidewalls of the recess 120. The second side-wall frames 133 and 143 arepositioned on at least one of the internal side walls of the recess 120.

Since the lead frames 130 and 140 having the above structure havesuperior thermal conductivity due to the characteristic of the materialthereof, heat can be very effectively dissipated out of the package.

The lead frames 130 and 140 may be integrated with each other inside therecess 120 and may have different lengths. The thickness of the leadframes 130 and 140 may be in the range of about 20 μm to about 300 μm.

In addition, a separation film 125 may be formed between the lead frames130 and 140. The separation film 125 constitutes a portion of the body110 and separates the lead frames 130 and 140 from each other.Accordingly, the lead frames 130 and 140 can reflect the light whileacting as an electrode. In addition, the lead frames 130 and 140 candissipate heat.

Both side walls of the recess 120 in the X axis direction, that is, theleft/right side walls of the recess 120 constitute portions of the bodyand are inclined at a predetermined angle. In addition, the side wallson which the second side-wall frames 133 and 143 are positioned may beinclined. The separation film 125 provided in the recess 120 and theinternal side walls of the recess are simultaneously formed when thebody 110 is molded.

The light emitting device 150 is provided at least one of the leadframes 130 and 140 provided in the recess 120, and may be electricallyconnected to the lead frames 130 and 140. The light emitting device 150may be mounted on the lead frames 130 and 140 through a wire bondingscheme, a flip bonding scheme, or a die bonding scheme.

The light emitting device 150 may include a compound semiconductor of agroup III-V element and include at least one of AlGaN, GaN, InGaAlP, andGaAs-based LED chips. In addition, a protective device such as a zenerdiode may be mounted in order to protect the light emitting device 150.

Meanwhile, the light emitting device package 100 may be realized as awhite light emitting device by using a blue LED chip, a yellowluminescence material (e.g., a silicate-based luminescence material), anorange luminescence material, a green luminescence material, and a redluminescence material according to the realization type. In addition,the light emitting device package 100 may be realized as a light sourcerealized through the combination of at least one or more of a red LEDchip, a green LED chip, a blue LED chip, a yellow LED chip, and a UV LEDchip.

In addition, a resin member may be molded in the recess 120 in order toprotect the light emitting device 150. The resin member may comprisetransparent epoxy or transparent silicone, and may be molded by addingluminescence powder if necessary. The resin member may compriseselectively molding liquid or additives according to a use purpose, ause environment, and the characteristic of a product. The surface of theresin member may be formed in one of a flat shape, a concave lens shape,and a convex lens shape.

FIG. 4 is a sectional view showing a light emitting device packageaccording to another embodiment of the present invention.

As described above, the protrusion portions 133 b and 143 b of thesecond side-wall frames 133 and 143 may be positioned on the top surfaceof the body 110 according to positions at which the second side-wallframes 133 and 143 of the lead frames 130 and 140 are bent.

In this case, portions of the lead frames 130 and 140 are provided onthe top surface of the body 110, so that the area of the lead frames 130and 140 exposed to the outside is increased. Accordingly, a heatdissipation characteristic can be more improved by the lead frames 130and 140.

A plurality of light emitting device packages according to theembodiment (embodiments) may be arrayed and used as light sources of anindicator (signal lamps), a lighting apparatus (headlight of a vehicle,fluorescent lamps, and street lamps), and a display apparatus (e.g.,electric sign boards and LCD panels). In addition, the embodiment may beselectively adapted to another embodiment, and the present invention isnot limited thereto.

FIG. 5 is an exploded perspective view showing a display apparatusaccording to the embodiment.

Referring to FIG. 5, the display apparatus 1000 according to theembodiment comprises a light guide plate 1041, a light emitting module1031 for supplying the light to the light guide plate 1041, a reflectivemember 1022 provided below the light guide plate 1041, an optical sheet1051 provided on the light guide plate 1041, a display panel 1061provided on the optical sheet 1051, and a bottom cover 1011 forreceiving the light guide plate 1041, the light emitting module 1031,and the reflective member 1022. However, the embodiment is not limitedto the above structure.

The bottom cover 1011, the reflective member 1022, the light guide plate1041 and the optical sheet 1051 may constitute a light unit 1050.

The light guide plate 1041 diffuses the light to provide surface light.The light guide plate 1041 may comprise transparent material. Forinstance, the light guide plate 1041 may comprise one of acryl-basedresin such as PMMA (polymethyl methacrylate, PET (polyethyleneterephthalate), PC (polycarbonate), COC (cyclic olefin copolymer) andPEN (polyethylene naphthalate) resin.

The light emitting module 1031 may be disposed on the light guide plate1041 to supply the light to the light guide plate 1041. In other words,the light emitting module 1031 may be disposed in at one side of thelight guide plate 1041. The light emitting module 1031 serves as thelight source of the display apparatus.

At least one light emitting module 1031 is provided to directly orindirectly supply the light from one side of the light guide plate 1041.The light emitting module 1031 may comprise a substrate 1033 and lightemitting device packages 100 according to the embodiments. The lightemitting device and the light emitting device packages 100 may bearrayed on the substrate 1033 while being spaced apart from each otherat the predetermined interval. In other words, light emitting devicesmay be arrayed on the substrate 1033 in the form of a chip or a package.

The substrate 1033 may comprise a printed circuit board (PCB) includinga circuit pattern. In addition, the substrate 1033 may comprise a metalcore PCB (MCPCB) or a flexible PCB (FPCB) as well as a typical PCB, butthe embodiment is not limited thereto. If the light emitting devicepackage 100 is installed on the side of the bottom cover 1011 or on aheat dissipation plate, the substrate 1033 may be omitted. The heatdissipation plate partially makes contact with the top surface of thebottom cover 1011.

In addition, the light emitting device package 100 may be arranged onthe substrate 1033 such that a light extraction surface of the lightemitting device package 100 is spaced apart from the light guide plate1041 by a predetermined distance, but the embodiment is not limitedthereto. The light emitting device package 1000 may directly orindirectly supply the light to a light incident surface, which is oneside of the light guide plate 1041, but the embodiment is not limitedthereto.

The reflective member 1022 may be disposed below the light guide plate1041. The reflective member 1022 reflects the light, which travelsdownward through the bottom surface of the light guide plate 1041,upward, thereby improving the brightness of the light unit 1050. Forinstance, the reflective member 1022 may comprise PET, PC or PVC resin,but the embodiment is not limited thereto. The reflective member 1022may serve as the top surface of the bottom cover 1011, but theembodiment is not limited thereto.

The bottom cover 1011 may receive the light guide plate 1041, the lightemitting module 1031, and the reflective member 1022. To this end, thebottom cover 1011 may have a receiving section 1012 having a box shapewith an opened top surface, but the embodiment is not limited thereto.The bottom cover 1011 can be coupled with the top cover, but theembodiment is not limited thereto.

The bottom cover 1011 can be manufactured through a press process or anextrusion process by using metallic material or resin material. Inaddition, the bottom cover 1011 may comprise metal or non-metallicmaterial having superior thermal conductivity, but the embodiment is notlimited thereto.

The display panel 1061, for instance, is an LCD panel including firstand second transparent substrates, which are opposite to each other andcomprise a transparent material, and a liquid crystal layer interposedbetween the first and second substrates. A polarizing plate can beattached to at least one surface of the display panel 1061, but theembodiment is not limited thereto. The display panel 1061 displaysinformation by a light passing through an optical sheet 1051. Thedisplay apparatus 1000 can be applied to various portable terminals,monitors of notebook computers, monitors of laptop computers, andtelevisions.

The optical sheet 1051 may be disposed between the display panel 1061and the light guide plate 1041, and comprise at least one transmissivesheet. For instance, the optical sheet 1051 comprises at least one of adiffusion sheet, a horizontal and vertical prism sheet, and a brightnessenhanced sheet. The diffusion sheet diffuses the incident light, thehorizontal and vertical prism sheet concentrates the incident light ontothe display panel 1061, and the brightness enhanced sheet improves thebrightness by reusing the lost light. In addition, a protective sheetmay be provided on the display panel 1061, but the embodiment is notlimited thereto.

The light guide plate 1041 and the optical sheet 1051 may be provided inthe light path of the light emitting module 1031 as optical members, butthe embodiment is not limited thereto.

FIG. 6 is a sectional view showing the display apparatus according tothe embodiment. The package disclosed in the description referring toFIG. 6 comprises light emitting devices arrayed in the form of a chip ora package.

Referring to FIG. 6, the display apparatus 1100 comprises a bottom cover1152, a substrate 1120 on which the light emitting device packages 100are arrayed, an optical member 1154, and a display panel 1155.

The substrate 1120 and the light emitting device packages 100 mayconstitute the light emitting module 1031. In addition, the bottom cover1152, at least one light emitting module 1031, and the optical member1154 may constitute the light unit. Light emitting devices may bearrayed on the substrate 1120 in the form of a chip or a package.

The bottom cover 1151 can be provided with a receiving section 1153, butthe embodiment is not limited thereto.

The optical member 1154 may comprise at least one of a lens, a lightguide plate, a diffusion sheet, a horizontal and vertical prism sheet,and a brightness enhanced sheet. The light guide plate may comprise PCor PMMA (Poly methyl methacrylate). The light guide plate may beomitted. The diffusion sheet diffuses the incident light, the horizontaland vertical prism sheet concentrates the incident light onto thedisplay panel 1155, and the brightness enhanced sheet improves thebrightness by reusing the lost light.

FIG. 7 is a perspective view showing a lighting system 1500 according tothe embodiment.

Referring to FIG. 7, the lighting system 1500 comprises a case 1510, alight emitting module 1530 installed in the case 1510, and a connectionterminal 1520 installed in the case 1510 to receive power from anexternal power source.

Preferably, the case 1510 comprises material having superior heatdissipation property. For instance, the case 1510 comprises metallicmaterial or resin material.

The light emitting module 1530 may comprise a substrate 1532 and a lightemitting device or light emitting device package 200 according to theembodiment installed on the substrate 1532. The light emitting devicepackages 200 are spaced apart from each other or arranged in the form ofa matrix. Light emitting devices may be arrayed on the substrate 1532 inthe form of a chip or a package.

The substrate 1532 comprises an insulating member printed with a circuitpattern. For instance, the substrate 1532 comprises a PCB, an MCPCB, anFPCB, a ceramic PCB, and an FR-4 substrate.

In addition, the substrate 1532 may comprise material that effectivelyreflects the light. A coating layer can be formed on the surface of thesubstrate 1532. At this time, the coating layer has a white color or asilver color to effectively reflect the light.

At least one light emitting device package 200 may be installed on thesubstrate 1532. Each light emitting device package 200 may comprise atleast one LED (light emitting diode) chip. The LED chip may comprise anLED that emits the light of visible ray band having red, green, blue orwhite color and a UV (ultraviolet) LED that emits UV light.

The light emitting device packages 200 of the light emitting module 1530can be variously arranged to provide various colors and brightness. Forinstance, the white LED, the red LED and the green LED may be arrangedto achieve the high color rendering index (CRI).

The connection terminal 1520 is electrically connected to the lightemitting module 1530 to supply power to the light emitting module 1530.The connection terminal 1520 has a shape of a socket screw-coupled withthe external power source, but the embodiment is not limited thereto.For instance, the connection terminal 1520 may be prepared in the formof a pin inserted into the external power source or connected to theexternal power source through a wire.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

1. A light emitting device package comprising: a body having a recess; alight emitting device received in the recess; and a lead frame connectedto the light emitting device, wherein the lead frame comprises a bottomframe formed on a bottom surface of the recess, a first side-wall frameformed on a side wall of the recess, and a second side-wall frame formedon a side wall of the recess and bent at a predetermined angle, andwherein the second side-wall frame comprises a side-wall portionpositioned on the side wall of the recess and a protrusion portion bentfrom the side-wall portion, and the protrusion portion of the secondside-wall frame is positioned on a top surface of the body.
 2. The lightemitting device package of claim 1, wherein a pair of first side-wallframes extend from the bottom frame along the side walls of the recesswhile facing each other.
 3. The light emitting device package of claim1, wherein the second side-wall frame is integrated with the firstside-wall frame.
 4. The light emitting device package of claim 1,wherein the body comprises a material selected from the group consistingof polyphthal amide (PPA), polyamide 9T (PA9T), liquid crystal polymer(LCP), and syndiotactic polystyrene (SPS).
 5. The light emitting devicepackage of claim 1, wherein the side wall of the recess provided thereonwith the first side-wall frame is inclined.
 6. The light emitting devicepackage of claim 1, wherein the side wall of the recess provided thereonwith the second side-wall frame is inclined.
 7. The light emittingdevice package of claim 1, wherein the lead frame comprises a materialselected from the group consisting of iron (Fe), tin (Sn), chromium(Cr), Zinc (Zn), nickel (Ni), aluminum (Al), silver (Ag), gold (Au),copper (Cu), and alloy thereof.
 8. The light emitting device package ofclaim 1, wherein the protrusion portion of the second side-wall frame isbent at a height of the first side-wall frame.
 9. A display apparatuscomprising: a light emitting apparatus comprising at least one lightemitting device package; a light guide plate provided on the lightemitting apparatus; and a display panel provided on the light guideplate, wherein the light emitting device package comprises a body havinga recess, a light emitting device provided in the recess, and a leadframe connected to the light emitting device, wherein the lead framecomprises a bottom frame formed on a bottom surface of the recess, afirst side-wall frame formed on a side wall of the recess, and a secondside-wall frame formed on a side wall of the recess and bent at apredetermined angle, and wherein the second side-wall frame comprises aside-wall portion positioned on the side wall of the recess and aprotrusion portion bent from the side-wall portion, and the protrusionportion of the second side-wall frame is positioned on a top surface ofthe body.
 10. The display apparatus of claim 9, wherein a pair of firstside-wall frames extend from the bottom frame along the side walls ofthe recess while facing each other.
 11. The display apparatus of claim9, wherein the second side-wall frame is integrated with the firstside-wall frame.
 12. The display apparatus of claim 9, wherein the bodycomprises a material selected from the group consisting of polyphthalamide (PPA), polyamide 9T (PA9T), liquid crystal polymer (LCP), andsyndiotactic polystyrene (SPS).
 13. The display apparatus of claim 9,wherein the side wall of the recess provided thereon with the firstside-wall frame is inclined.
 14. The display apparatus of claim 9,wherein the side wall of the recess provided thereon with the secondside-wall frame is inclined.
 15. The display apparatus of claim 9,wherein the lead frame comprises a material selected from the groupconsisting of iron (Fe), tin (Sn), chromium (Cr), Zinc (Zn), nickel(Ni), aluminum (Al), silver (Ag), gold (Au), copper (Cu), and alloythereof.
 16. The display apparatus of claim 9, wherein the protrusionportion of the second side-wall frame is bent at a height of the firstside-wall frame.
 17. A lighting system comprising: a case; a lightemitting module provided in the case and comprising at least one lightemitting device package; and a connection terminal provided in the caseto receive power from an external power source, wherein the lightemitting device package comprises a body having a recess, a lightemitting device received in the recess, and a lead frame connected tothe light emitting device, wherein the lead frame comprises a bottomframe formed on a bottom surface of the recess, a first side-wall frameformed on a side wall of the recess, and a second side-wall frame formedon a side wall of the recess and bent at a predetermined angle, andwherein the second side-wall frame comprises a side-wall portionpositioned on the side wall of the recess and a protrusion portion bentfrom the side-wall portion, and the protrusion portion of the secondside-wall frame is positioned on a top surface of the body.
 18. Thelighting system of claim 17, wherein a pair of first side-wall framesextends from the bottom frame along the side walls of the recess whilefacing each other.
 19. The lighting system of claim 17, wherein thesecond side-wall frame is integrated with the first side-wall frame. 20.The lighting system of claim 17, wherein the protrusion portion of thesecond side-wall frame is bent at a height of the first side-wall frame.